Spoked solder pad



FIG. 1 is a top plan view of my new design for a solder pad.

FIG. 2 is a top plan view of the solder pad of FIG. 1 with illustrative radial axes drawn.

FIG. 3 is a top plan view of the solder pad of FIG. 1 with illustrative adjacent circuit board traces and vias.

FIG. 4 is a perspective view of the solder pad of FIG. 1 on an illustrative integrated circuit package; and,

FIG. 5 is a perspective view of the solder pad of FIG. 1 on an illustrative circuit board.

Broken line illustrations of environmental structure in the drawings, including the radial axes in FIG. 2, circuit board traces and vias in FIG. 3, integrated circuit package outlines in FIG. 4, and circuit board outlines in FIG. 5, are provided for illustrative purposes only and form no part of the claimed design. 

CLAIM The ornamental design for a spoked solder pad, as shown and described. 